Ukuhlolwa kweemveliso ze-electroplated terminal ngumsebenzi oyimfuneko emva kokuba i-electroplating igqityiwe. Kuphela imveliso ye-electroplated edlula ukuhlolwa inganikezelwa kwinkqubo elandelayo yokusetyenziswa.
Ngokwesiqhelo, izinto zokuhlolwa kweemveliso ezifakwe ngumbane zezi: ubukhulu befilimu, ukuncamathelisa, amandla e-solder, inkangeleko, ukupakishwa, kunye novavanyo lwesitshizi setyuwa. Kwiimveliso ezineemfuno ezikhethekileyo kwimizobo, kukho iimvavanyo ze-porosity (30U ") zegolide usebenzisa indlela ye-nitric acid umphunga, iimveliso ze-nickel ze-palladium-plated (usebenzisa indlela ye-gel electrolysis) okanye ezinye iimvavanyo zokusingqongileyo.
1. Ukuhlolwa kwemveliso ye-Electroplating-film ukutyeba
1.Ubukhulu befilimu yinto esisiseko yokuhlolwa kwe-electroplating. Isixhobo esisisiseko esisetyenzisiweyo imitha yobukhulu befilimu ye-fluorescent (X-RAY). Umgaqo kukusebenzisa i-X-rays ukukhupha i-irradiate, ukuqokelela i-spectrum yamandla ebuyiselwe yi-coating, kunye nokuchonga ubukhulu kunye nokubunjwa kwengubo.
2. Izilumkiso xa usebenzisa iX-RAY:
1) Ulungelelwaniso lweSpectrum luyafuneka ngalo lonke ixesha uvula ikhompyuter
2) Yenza ulungelelwaniso lwe-crosshair rhoqo ngenyanga
I-3) Ukulinganisa i-Gold-nickel kufuneka kwenziwe ubuncinane kanye ngeveki
4) Xa ulinganisa, ifayile yokuvavanya kufuneka ikhethwe ngokwentsimbi esetyenziswe kwimveliso.
5) Kwiimveliso ezintsha ezingenayo ifayile yokuvavanya, ifayile yokuvavanya kufuneka yenziwe.
3. Ukubaluleka kweefayile zovavanyo:
Umzekelo: Au-Ni-Cu(100-221 sn 4%@0.2 cfp
I-Au-Ni-Cu——Vavanya ubungqingqwa be-nickel plating uze emva koko uhonjiswe ngegolide kwi-substrate yobhedu.
(100-221 sn 4%——-AMP inombolo yempahla yobhedu yobhedu equlethe i-4% yetoti)
2. Ukuhlolwa kwemveliso ye-Electroplating-adhesion
Ukuhlolwa kokubambelela yinto eyimfuneko yokuhlola iimveliso ze-electroplating. Ukubambelela kakubi yeyona nto ixhaphakileyo ekuhlolweni kwemveliso ye-electroplating. Ngokuqhelekileyo kukho iindlela ezimbini zokuhlola:
I-1. Indlela yokugoba: Okokuqala, sebenzisa iphepha lobhedu elinobunzima obufanayo ne-terminal efunekayo yokubhaqa ukuze udibanise indawo egobileyo, sebenzisa iimpumlo zempumlo ezicwebileyo ukugoba isampuli kwii-degrees ze-180, kwaye usebenzise i-microscope ukujonga ukuba kukho. ukuxobula okanye ukuxobula isambatho kwindawo egobileyo.
Indlela ye-2.I-tape: Sebenzisa i-3M tape ukuze unamathele ngokuqinileyo kumphezulu wesampula oza kuvavanywa, ngokuthe nkqo kwii-degrees ze-90, ngokukhawuleza ukrazule i-tape, kwaye ukhangele ifilimu yensimbi ekhupha kwi-tape. Ukuba awukwazi ukujonga ngokucacileyo ngamehlo akho, ungasebenzisa i-microscope ye-10x ukujonga.
3. Ukumiselwa kweziphumo:
a) Makungawi umgubo wentsimbi okanye ukuncamatheliswa kweteyiphu yokuchwetheza.
b) Kufuneka kungabikho ukuxobula kwengubo yentsimbi.
c) Ngethuba nje izinto ezisisiseko zingaphulwanga, akufuneki kubekho ukuqhekeka okunzulu okanye ukuxobula emva kokugoba.
d) Makungabikho kuqhwatywa.
e) Akufuneki kubekho ukuvezwa kwentsimbi engaphantsi ngaphandle kokuba isiseko siphulwe.
4. Xa i-adhesion ihlwempuzekile, kufuneka ufunde ukwahlula indawo yoluhlu oluhlanjululweyo. Ungasebenzisa i-microscope kunye ne-X-RAY ukuvavanya ubukhulu be-coat coating ukugqiba indawo yokusebenza kunye nengxaki.
3. Ukuhlolwa kwemveliso ye-Electroplating-solderability
I-1.I-Solderability ngumsebenzi osisiseko kunye nenjongo ye-tin-lead kunye ne-tin plating. Ukuba kukho iimfuno zenkqubo ye-post-soldering, i-welding engafanelekanga iyisiphene esibi.
I-2.Iindlela ezisisiseko zovavanyo lwe-solder:
I-1) Indlela yokuntywiliselwa ngokuthe ngqo kwi-tin: Ngokwemizobo, gcoba ngokuthe ngqo inxalenye ye-solder kwi-flux efunekayo kwaye uyifake kwisithando somlilo se-235-degree. Emva kwemizuzwana emi-5, kufuneka ikhutshwe kancinci ngesantya esimalunga ne-25MM/S. Emva kokuyikhupha, yipholise kwiqondo lokushisa eliqhelekileyo kwaye usebenzise i-microscope ye-10x ukujonga kwaye ugwebe: indawo enetoti kufuneka ibe nkulu kune-95%, indawo enetoti kufuneka igudiswe kwaye icoceke, kwaye akukho nto yokwenqaba i-solder, i-desoldering, i-pinholes kunye ne-pinholes. ezinye iziganeko, nto leyo ethetha ukuba ifanelekile.
2) Ukuguga kuqala kwaye emva koko ukuwelda. Kwiimveliso ezineemfuno ezizodwa kwiindawo ezithile zamandla, iisampulu kufuneka zibe mdala kangangeeyure ezisi-8 okanye ezili-16 kusetyenziswa umatshini wokuvavanya ukuguga komphunga phambi kovavanyo lwe-welding ukumisela ukusebenza kwemveliso kwiindawo ezisetyenziswa kakubi. Ukusebenza kweWelding.
4. Ukuhlolwa kwemveliso ye-Electroplating-imbonakalo
1.Ukuhlolwa kokubonakala yinto esisiseko yokuhlola ukuhlolwa kwe-electroplating. Ukususela kwimbonakalo, sinokubona ukufaneleka kweemeko zenkqubo ye-electroplating kunye notshintsho olunokwenzeka kwisisombululo se-electroplating. Abathengi abahlukeneyo baneemfuno ezahlukeneyo zokubonakala. Zonke iitheminali ezine-electroplated kufuneka zijongwe nge-microscope ubuncinane amaxesha angama-10 amakhulu. Kwiziphene ezenzeke, okukhona ukukhulisa, kunceda ngakumbi ukuhlalutya unobangela wengxaki.
2. Amanyathelo okuhlola:
1). Thatha isampuli kwaye uyibeke phantsi kwe-10x microscope, kwaye uyikhanyise ngokuthe nkqo ngomthombo wokukhanya omhlophe oqhelekileyo:
2). Qwalasela imeko yomphezulu wemveliso ngokusebenzisa i-eyepiece.
3. Indlela yokugweba:
1). Umbala kufuneka ube yinto efanayo, ngaphandle kombala omnyama okanye okhanyayo, okanye imibala eyahlukileyo (efana nobumnyama, ubomvu, okanye umthubi). Kufuneka kungabikho mahluko unzima wombala ekuhonjisweni kwegolide.
2). Musa ukuvumela nayiphi na into yangaphandle (iinwele zeenwele, uthuli, ioli, iikristale) ukuba zibambelele kuyo
3). Kufuneka yome kwaye ingangcoliswa kukufuma.
4). Ukuguda okuhle, akukho mingxunya okanye amasuntswana.
5). Akufunekanga kubekho uxinzelelo, imikrwelo, imikrwelo kunye nezinye izinto eziguquguqukayo kunye nomonakalo kwiindawo ezicandiweyo.
6). Umaleko ongezantsi kufuneka ungavezwa. Ngokumalunga nokubonakala kwe-tin-lead, ezimbalwa (kungekho ngaphezu kwe-5%) imigodi kunye nemigodi evumelekileyo nje ukuba ayichaphazeli i-solderability.
7). Ukwaleka akufuneki kube namadyungudyungu, ukuxobuka okanye ukuncamathela okungalunganga.
8). Isikhundla se-electroplating siya kwenziwa ngokuhambelana nemizobo. Injineli ye-QE inokugqiba isigqibo sokukhulula umgangatho ngokufanelekileyo ngaphandle kokuchaphazela umsebenzi.
9). Kwiziphene zenkangeleko ezikrokrisayo, injineli ye-QE kufuneka imisele iisampulu emiselweyo kunye nemigangatho encedisayo yembonakalo.
5. Ukuhlolwa kwemveliso ye-Electroplating-packaging
Ukuhlolwa kokupakishwa kwemveliso ye-electroplating kufuna ukuba ulwalathiso lokupakisha luchanekile, iileyibhile zokupakisha kunye neebhokisi zicocekile kwaye zicocekile, kwaye akukho monakalo: iilebula zigqityiwe kwaye zichanekile, kwaye inani leelebula zangaphakathi nangaphandle zihambelana.
6.Uvavanyo lwemveliso ye-Electroplating-ityuwa yokutshiza
Emva kokuphumelela uvavanyo lwesitshizi setyuwa, umphezulu wamalungu angenawo umnxeba uya kuba mnyama kwaye aphuhlise umhlwa obomvu. Ngokuqinisekileyo, iintlobo ezahlukeneyo ze-electroplating ziya kuvelisa iziphumo ezahlukeneyo.
Uvavanyo lokutshiza ityuwa yeemveliso ze-electroplating lwahlulwe lwaba ngamacandelo amabini: enye luvavanyo lokuvezwa kwendalo; enye luvavanyo lokusingqongileyo olukhawulezileyo olufaniswayo lwetyuwa. Uvavanyo lokusingqongileyo olulinganisiweyo lokutshiza ityuwa kukusebenzisa izixhobo zovavanyo kunye nendawo ethile umthamo - igumbi lovavanyo lokutshiza ityuwa, ukusebenzisa iindlela ezenziweyo kwisithuba somthamo walo wokudala indawo yokutshiza ityuwa ukuvavanya ukusebenza kokumelana nokutshiza kwetyuwa kunye nomgangatho wetyuwa. imveliso. .
Iimvavanyo ezenziweyo ezenziweyo zokutshiza ityuwa ziquka:
1) Uvavanyo lokutshiza lwetyuwa olungathathi hlangothi (uvavanyo lwe-NSS) yeyona ndlela yokuvavanya umhlwa yakuqala ngeyona ndawo ibanzi yesicelo. Isebenzisa i-5% yesisombululo setyuwa ye-sodium chloride, kwaye ixabiso le-pH lesisombululo lilungelelaniswa kuluhlu olungathathi hlangothi (6 ukuya ku-7) njengesisombululo sokutshiza. Ubushushu bovavanyo buyi-35℃ yonke, kwaye izinga lentlenga yesitshizi setyuwa liyafuneka ukuba libe phakathi kwe-1~2ml/80cm?.h.
2) Uvavanyo lwe-acetate yetyuwa yokutshiza (uvavanyo lwe-ASS) luphuhliswa ngesiseko sovavanyo lwe-salt spray olungathathi hlangothi. Yongeza i-glacial acetic acid kwi-5% yesisombululo se-sodium chloride ukunciphisa ixabiso le-pH yesisombululo malunga ne-3, ukwenza isisombululo sibe ne-acidic, kunye nesiphumo sokutshiza setyuwa sitshintsha ukusuka kwisitshizi setyuwa engathathi hlangothi ukuya kwi-acidic. Izinga lokubola kwayo malunga namaxesha ama-3 ngokukhawuleza kunovavanyo lwe-NSS.
3)Ityuwa yobhedu ikhawulezise uvavanyo lwesitshizi setyuwa ye-acetate (uvavanyo lwe-CASS) luvavanyo olukhawulezayo lokutshiza lwetyuwa olusanda kuphuhliswa phesheya. Ubushushu bovavanyo yi-50°C. Isixa esincinci sobhedu setyuwa-i-chloride yethusi yongezwa kwisisombululo setyuwa ukuze sikhuthaze ngamandla ukubola. Izinga lokubola kwayo malunga namaxesha esi-8 kuvavanyo lwe-NSS.
Le ingentla yimigangatho yokuhlola kunye neendlela zokuhlola iimveliso ezifakwe kwi-electroplated, kubandakanywa ukuhlolwa kobukhulu befilimu ye-electroplated, ukuhlolwa kokunamathela, ukuhlolwa kwe-weldability, ukuhlolwa kwembonakalo, ukuhlolwa kokupakishwa, uvavanyo lokutshiza ityuwa,
Ixesha lokuposa: Jun-05-2024