Ukuhlolwa kwemikhiqizo ye-electroplated terminal kuwumsebenzi obalulekile ngemuva kokuqedwa kokufakwa kwe-electroplating. Imikhiqizo ye-electroplated kuphela edlula ukuhlolwa enganikezwa kunqubo elandelayo ukuze isetshenziswe.
Imvamisa, izinto zokuhlola zemikhiqizo efakwe i-electroplated yilezi: ukujiya kwefilimu, ukunamathela, ikhono le-solder, ukubukeka, ukupakishwa, nokuhlolwa kwesifutho sikasawoti. Emikhiqizweni enezidingo ezikhethekile emidwebeni, kukhona ukuhlolwa kwe-porosity (30U”) kwegolide kusetshenziswa indlela ye-nitric acid vapor, imikhiqizo ye-nickel ye-palladium-plated (kusetshenziswa indlela ye-gel electrolysis) noma ezinye izivivinyo zemvelo.
1. Ukuhlolwa komkhiqizo we-Electroplating-ukuqina kwefilimu
1.Ukujiya kwefilimu kuyinto eyisisekelo yokuhlolwa kwe-electroplating. Ithuluzi eliyisisekelo elisetshenziswa imitha yokujiya ifilimu ye-fluorescent (X-RAY). Isimiso siwukusebenzisa ama-X-ray ukuze kucwebezeliswe i-coating, ukuqoqa i-spectrum yamandla ebuyiswa yi-coating, futhi kukhombe ukujiya nokwakheka kwe-coating.
2. Izinyathelo zokuqapha lapho usebenzisa i-X-RAY:
1) Ukulinganisa kwe-Spectrum kuyadingeka njalo uma uvula ikhompuyutha
2) Yenza ukulinganisa kwe-crosshair njalo ngenyanga
3) Ukulinganisa kwegolide-nickel kufanele kwenziwe okungenani kanye ngesonto
I-4) Lapho ukala, ifayela lokuhlola kufanele likhethwe ngokusho kwensimbi esetshenziswe kumkhiqizo.
5) Ngemikhiqizo emisha engenalo ifayela lokuhlola, ifayela lokuhlola kufanele lenziwe.
3. Ukubaluleka kwamafayela okuhlola:
Isibonelo: Au-Ni-Cu(100-221 sn 4%@0.2 cfp
I-Au-Ni-Cu——Hlola ukujiya kwe-nickel plating bese unamathisele ngegolide ku-substrate yethusi.
(100-221 sn 4%——-AMP inombolo yento yethusi yethusi equkethe 4% ithini)
2. Ukuhlolwa komkhiqizo we-Electroplating-adhesion
Ukuhlolwa kokunamathela kuyinto edingekayo yokuhlola imikhiqizo ye-electroplating. Ukunamathela okungalungile kuyisici esivame kakhulu ekuhlolweni komkhiqizo we-electroplating. Ngokuvamile kunezindlela ezimbili zokuhlola:
1.Indlela yokugoba: Okokuqala, sebenzisa ishidi lethusi elinogqinsi olufana netheminali yokuthola edingekayo ukuze upheqe indawo ezogotshwa, sebenzisa udlawu lwekhala eliyisicaba ukuze ugobise isampula libe ngamadigri angu-180, futhi usebenzise isibonakhulu ukuze ubone ukuthi kukhona yini ukuxebuka noma ukuxebuka kwento enamathelayo endaweni egobile.
2.Indlela yetheyiphu: Sebenzisa itheyiphu engu-3M ukuze unamathele ngokuqinile ebusweni besampula okufanele ihlolwe, iqonde kuma-degree angu-90, ukhiphe ngokushesha itheyiphu, futhi ubuke ifilimu yensimbi ixebuka kutheyiphu. Uma ungakwazi ukubona ngokucacile ngamehlo akho, ungasebenzisa isibonakhulu esingu-10x ukuze ubone.
3. Ukunqunywa kwemiphumela:
a) Akufanele kube nokuwa kwempushana yensimbi noma ukunamathela kwetheyiphu yokuchibiyela.
b) Akufanele kube nokuxebuka kwensimbi enamathelayo.
c) Uma nje isisekelo singaphukile, akufanele kube nokuqhekeka okukhulu noma ukuxebuka ngemva kokugoba.
d) Akufanele kube khona ukubhavumula.
e) Akumele kube khona ukuvezwa kwensimbi engaphansi ngaphandle kokuphulwa kwesisekelo.
4. Uma ukunamathela kungalungile, kufanele ufunde ukuhlukanisa indawo yongqimba oluhlutshiwe. Ungasebenzisa isibonakhulu kanye ne-X-RAY ukuhlola ukujiya koqweqwe oluhlutshiwe ukuze unqume isiteshi somsebenzi esinenkinga.
3. Ukuhlolwa komkhiqizo we-Electroplating-solderability
I-1.I-Solderability iwumsebenzi oyisisekelo nenjongo ye-tin-lead kanye ne-tin plating. Uma kunezidingo zenqubo ye-post-soldering, ukushisela okungalungile kuyisici esibi kakhulu.
2.Izindlela eziyisisekelo zokuhlola i-solder:
I-1) Indlela ye-tin yokucwiliswa eqondile: Ngokusho kwemidwebo, cwilisa ngokuqondile ingxenye ye-solder ku-flux edingekayo bese uyicwilisa esithandweni somlilo se-235-degree. Ngemuva kwemizuzwana emi-5, kufanele ikhishwe kancane kancane ngesivinini esingaba ngu-25MM/S. Ngemuva kokuyikhipha, yipholise ekushiseni okujwayelekile futhi usebenzise isibonakhulu esingu-10x ukuze ubheke futhi ugwebe: indawo ethayiwe kufanele ibe nkulu kune-95%, indawo efakwe uthayela kufanele ibe bushelelezi futhi ihlanzeke, futhi akukho ukwenqatshwa kwe-solder, i-desoldering, imigodi kanye nemigodi. ezinye izenzakalo, okusho ukuthi ifanelekile.
2)Ukuguga kuqala bese kuba ukushisela. Emikhiqizweni enezidingo ezikhethekile ezindaweni ezithile zamandla, amasampula kufanele abe madala amahora angu-8 noma angu-16 kusetshenziswa umshini wokuhlola ukuguga ngaphambi kokuhlolwa kokushisela ukuze kutholwe ukusebenza komkhiqizo ezindaweni zokusetshenziswa ezinonya. Ukusebenza kwe-welding.
4. Ukuhlolwa komkhiqizo we-Electroplating-ukubukeka
1.Ukuhlolwa kokubukeka kuyinto eyisisekelo yokuhlola ukuhlolwa kwe-electroplating. Kusukela ekubukeni, singabona ukufaneleka kwezimo zenqubo ye-electroplating kanye nezinguquko ezingenzeka kusixazululo se-electroplating. Amakhasimende ahlukene anezidingo ezahlukene zokubukeka. Wonke amatheminali ane-electroplated kufanele abhekwe ngesibonakhulu okungenani izikhathi eziyi-10 ezinkulu. Kumaphutha okwenzekile, ukukhuliswa okukhulu, kuyasiza kakhulu ukuhlaziya imbangela yenkinga.
2.Izinyathelo zokuhlola:
1). Thatha isampula bese ulibeka ngaphansi kwesibonakhulu esingu-10x, futhi usikhanyisele sibheke phezulu ngomthombo wokukhanya omhlophe ojwayelekile:
2). Qaphela isimo esingaphezulu somkhiqizo ngokusebenzisa i-eyepiece.
3. Indlela yokwahlulela:
1). Umbala kufanele ube iyunifomu, ngaphandle kwanoma yimuphi umbala omnyama noma okhanyayo, noma ube nemibala ehlukene (njengokuba mnyama, ububomvu, noma ukuphuzi). Akufanele kube nomehluko ongathi sína wombala ekucwecweni kwegolide.
2). Ungavumeli noma iyiphi into yangaphandle (izinwele ezicwebezelayo, uthuli, uwoyela, amakristalu) ukuthi inamathele kukho
3). Kufanele yome futhi akufanele ingcoliswe umswakama.
4). Ubushelelezi obuhle, azikho izimbobo noma izinhlayiya.
5). Akufanele kube khona ukucindezelwa, imihuzuko, imihuzuko kanye nezinye izenzakalo zokuguqulwa kanye nokulimala ezingxenyeni ezicwebezelayo.
6). Isendlalelo esingezansi akufanele sivezwe. Ngokuqondene nokubukeka kwe-tin-lead, imigodi embalwa (hhayi ngaphezu kwe-5%) nemigodi evunyelwe inqobo nje uma ingathinti ukudayiswa.
7). Ukugqoka akufanele kube namabhamuza, ukuxebuka noma okunye ukunamathela okubi.
8). Isikhundla se-electroplating sizokwenziwa ngokuhambisana nemidwebo. Unjiniyela we-QE angase anqume ukuxegisa izinga ngendlela efanele ngaphandle kokuphazamisa umsebenzi.
9). Ngokukhubazeka okusolisayo kokubukeka, unjiniyela we-QE kufanele asethe isampuli yomkhawulo kanye namazinga asizayo okubukeka.
5. Ukuhlolwa kokupakishwa komkhiqizo we-Electroplating
Ukuhlolwa kokupakishwa komkhiqizo we-electroplating kudinga ukuthi isiqondiso sokupakisha silungile, amathreyi okupakisha namabhokisi ahlanzekile futhi ahlanzekile, futhi akukho monakalo: amalebula aqediwe futhi alungile, kanye nenani lamalebula angaphakathi nangaphandle ahambisanayo.
6.Ukuhlolwa komkhiqizo we-Electroplating-usawoti wesifutho sikasawoti
Ngemva kokuphumelela ukuhlolwa kwesifutho sikasawoti, indawo engaphezulu yezingxenye ezingafanelekile ze-electroplated izoba mnyama futhi ibe nokugqwala okubomvu. Yiqiniso, izinhlobo ezahlukene ze-electroplating zizoveza imiphumela ehlukene.
Ukuhlolwa kwesifutho sikasawoti semikhiqizo ye-electroplating ihlukaniswe izigaba ezimbili: eyodwa ukuhlolwa kokuchayeka kwemvelo; enye iwukuhlolwa kwemvelo okusheshisiwe okwenziwe ngosawoti okufuthwayo. Ukuhlolwa kwemvelo okulingisa okufafazwa usawoti okulingisa ukusebenzisa imishini yokuhlola enendawo ethile yevolumu - igumbi lokuhlola isifutho sikasawoti, ukusebenzisa izindlela zokwenziwa endaweni yayo yevolumu ukuze kudale indawo yesifutho sikasawoti ukuze kuhlolwe ukusebenza kokumelana nokugqwala kwesifutho sikasawoti kanye nekhwalithi ye umkhiqizo. .
Ukuhlolwa kokwenziwa kwesifutho sikasawoti okulingisa kufaka phakathi:
1) Ukuhlolwa kwesifutho sikasawoti esimaphakathi (ukuhlolwa kwe-NSS) kuyindlela yokuqala yokuhlola ukugqwala esheshisiwe enenkambu yesicelo ebanzi kakhulu. Isebenzisa isisombululo sikasawoti se-sodium chloride esingu-5%, futhi inani le-pH lesixazululo lilungiswa libe yibanga elingathathi hlangothi (6 kuya ku-7) njengesixazululo sesifutho. Izinga lokushisa lokuhlola lonke lingu-35℃, futhi izinga lokuncibilika kwesifutho sikasawoti liyadingeka ukuthi libe phakathi kuka-1~2ml/80cm?.h.
2) Ukuhlolwa kwe-acetate salt spray test (ukuhlolwa kwe-ASS) kwenziwa ngesisekelo sokuhlolwa kwesifutho sikasawoti esingathathi hlangothi. Yengeza i-glacial acetic acid exazululweni le-sodium chloride engu-5% ukuze kwehliswe inani le-pH lesixazululo libe cishe ku-3, okwenza ikhambi libe ne-asidi, futhi isifutho sikasawoti esiwumphumela siphinde sishintshe sisuke ekubeni isifutho sikasawoti esimaphakathi siye esimuncu. Izinga lokugqwala kwalo lishesha izikhathi ezi-3 kunokuhlolwa kwe-NSS.
I-3) Ukuhlolwa kwe-acetate usawoti okusheshisa usawoti wethusi (ukuhlolwa kwe-CASS) ukuhlolwa kokugqwala kokugqwala kukasawoti okusheshayo okusanda kuthuthukiswa phesheya. Izinga lokushisa lokuhlola lingu-50°C. Inani elincane le-copper salt-copper chloride lifakwa esixazululweni sikasawoti ukuze libangele ukugqwala. Izinga lokugqwala kwalo cishe liphindwe kayisi-8 kunelokuhlolwa kwe-NSS.
Okungenhla ngamazinga okuhlola nezindlela zokuhlola zemikhiqizo efakwe ugesi, okuhlanganisa ukuhlola ukushuba komkhiqizo we-electroplated, ukuhlola ukunamathela, ukuhlolwa kokushisela, ukuhlolwa kokubukeka, ukuhlolwa kokupakisha, ukuhlolwa kwesifutho sikasawoti,
Isikhathi sokuthumela: Jun-05-2024